Thermo-mechanical description of material diffusion during an ultrasonic wire bonding process

Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules

High voltage and high current power modules are key components for traction applications. In the future, railway locomotives, tramways and elevators will be equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this field of application high reliability is of decisive importance, especially for aluminum bond wires with diameters up to 500 μm, connecting the silicon device with the ...

Ultrasonic friction power during Al wire wedge-wedge bonding

Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits. The bonding wire used is a 25 m diameter AlSi1 wire. A friction power model is used to derive the ultrasonic friction power during Al wire bonding. Auxiliary measurements include the current delivered to the ultraso...

Performance Study of an Ultrasonic Transducer used for Wire Bonding

-In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreem...

Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding

Investigation of ultrasonic vibrations of wire-bonding capillaries

Ultrasonic energy is widely used in wire bonding for microelectronics packaging. It is necessary to ensure that the maximum ultrasonic vibration displacement occurs at or near the tip of the bonding tool (capillary) for optimal performance. In this study, amplitude profiles of ultrasonic vibrations along capillaries were measured with load using a laser interferometer. This provided valuable in...